Physical Design Engineer Broadcom
Overview
Lead physical layout engineering for next generation ASIC products focusing on parallel interfaces. Develop advanced 2.5D and 3D interconnects while collaborating with R&D and manufacturing partners. Drive innovation in high-speed signal interconnects and new technology pathsfinding.
What You'll Do11
- 1Design implement power grids 2.5D and 3D die-die interconnects
- 2Perform DRC LVS and electrical checking
- 3Automate common layout processes and design steps
- 4Develop high-speed signal interconnects with SI and PI engineers
- 5Conduct electrical analysis and optimize ubump and RDL patterns
- 6Evaluate and develop new 2.5D and 3D interconnect technologies
- 7Create technology and testchip roadmaps emphasizing advanced packaging
- 8Manage multiple concurrent customers under tight deadlines
- 9Provide technical guidance for projects with limited information
- 10Utilize TCL and Python scripting to automate routine tasks
- 11Collaborate with global organization and customer base
Requirements8
- 1Independent self-starter comfortable managing diverse customer workloads
- 2Proven ability to guide teams through ambiguous situations
- 3Expertise with IC Package and PCB layout databases and tools
- 4Strong bachelor's degree in Electrical Engineering or Computer Science with 12+ years experience
- 5Master's degree in Electrical Engineering or Computer Science with 10+ years experience
- 612+ years related work experience or 10+ years with master's
- 712+ years related work experience for bachelor's holders
- 812+ years related work experience for master's holders
Salary Insight
$144 - $230k per year
Location
Required Skills
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