Advanced Packaging Manufacturing Manager, Substrate & Wafer Assembly
Overview
Owns and delivers advanced packaging manufacturing outcomes at scale within Intel's APTDSWA organization. Partners with engineering, integration, planning, quality, maintenance, and program teams to resolve complex issues and drive technology development milestones. Focuses on safety, quality, output, cost, cycle time, tool readiness, and WIP movement. This role blends hands-on manufacturing leadership with cross-functional collaboration to advance substrate packaging technology.
What You'll Do9
- 1Lead advanced packaging manufacturing deliverables across factory areas ensuring safety, quality, output, cost, cycle time, tool readiness, and schedule commitments.
- 2Set direction and operating standards to drive disciplined execution and manufacturing performance across assigned areas.
- 3Develop and execute resource and capacity plans to maximize equipment availability, factory stability, throughput, and readiness for current and future packaging needs.
- 4Collaborate with engineering, integration, maintenance, planning, quality, and programs to resolve complex manufacturing issues and achieve milestones.
- 5Drive prioritization and rapid decision support during non-standard operations, excursions, and recovery events.
- 6Strengthen standard work and training inputs to enable factory ramp, equipment qualification, and production readiness.
- 7Lead continuous improvement initiatives using Lean, Six Sigma, data analytics, and factory performance metrics to improve safety, quality, output, cost, yield, and cycle time.
- 8Coordinate shift handoffs, WIP movement, tool utilization, and cross-shift execution to meet production needs and business priorities.
- 9Model Intel values and cultivate safety and quality culture while influencing cross-functional partners
Requirements5
- 1Bachelor's degree in Engineering Manufacturing Operations or related STEM field and 6+ years of experience OR Master’s degree and 4+ years OR PhD and 2+ years
- 2Experience driving manufacturing execution factory readiness equipment performance and process improvement from development to high volume manufacturing
- 3Experience applying Lean MBPS Six Sigma root cause analysis and continuous improvement
- 4Experience leading cross-functional groups in a fast paced manufacturing environment
- 5Willingness to maintain a strong presence on the manufacturing floor and support compressed work-week shifts
Salary Insight
$164 - $232k per year
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