Manufacturing Operations Leader, Semiconductor FAB
Overview
You will lead end-to-end manufacturing operations for a semiconductor advanced packaging fab, owning wafer lot starts, cleanroom readiness, material flow, and workforce execution. With $1B+ in DoD and state funding, the Texas Institute for Electronics (TIE) at UT Austin is reestablishing U.S. semiconductor prominence. You will drive high-yield production through rigorous operational controls and tight coordination between production, engineering, facilities, and supply chain. This role expects 10+ years in FAB operations and a track record of scaling 24/7 manufacturing. Based in Austin, you will shape the future of 3D heterogeneous integration.
What You'll Do8
- 1Own the master wafer start plan and daily execution cadence, balancing demand, capacity, engineering work, and maintenance windows to hit output, cycle time, and on-time delivery targets.
- 2Align shift staffing with wafer start and production loads, ensuring gown room readiness for all shifts and enforcing cleanroom discipline and standard work.
- 3Drive seamless lot movement with zero wafer loss or misprocessing, optimizing AMHS reliability and manual transport to minimize handling defects and contamination.
- 4Manage spares availability to meet tool uptime and production goals, optimizing inventory cost while maintaining audit-ready traceability.
- 5Lead Lean, Six Sigma, and SPC initiatives to reduce cycle time, improve lot start predictability, and optimize inventory.
- 6Apply 8D and FMEA for root cause analysis of recurring FAB issues, driving continuous improvement and stability.
- 7Coordinate with engineering, facilities, and supply chain to ensure material flow and tool availability meet production needs.
- 8Implement and sustain MES logic and dispatch rules to enhance wafer lot control and WIP management.
Requirements9
- 110+ years in semiconductor FAB or advanced packaging manufacturing.
- 25+ years leading 24/7 manufacturing or operations teams.
- 3Direct experience managing wafer lot starts, WIP control, cleanroom and gown room operations, and FAB material flow.
- 4Strong background in advanced packaging or back-end semiconductor operations.
- 5Deep understanding of FAB manufacturing flows, wafer lot control, dispatch rules, and MES logic.
- 6Working knowledge of AMHS, wafer handling systems, spares, BOMs, preventive maintenance, inventory control, and ERP integration.
- 7Expertise in SPC, yield management, OEE, MTBF, MTTR, and cycle time analysis.
- 8Knowledge of ESD, contamination control, and cleanroom standards.
- 9Execution-focused leadership with operational rigor and financial acumen for inventory and cost optimization.
Salary Insight
Salary not disclosed in listing
Location
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