Senior Packaging Engineer at Analog Devices
Overview
We seek a Senior Packaging Engineer to drive NPI packaging solutions. This role delivers robust scalable packaging while enhancing supply chain resilience and improving development systems. You will partner with business units and global teams to define and release semiconductor packaging meeting performance cost and schedule targets.
What You'll Do11
- 1Partner with Business Units to define develop and release semiconductor packaging solutions as part of the NPI pipeline
- 2Drive package design qualification and production readiness to satisfy performance cost and schedule requirements
- 3Collaborate with design reliability QA and operations teams for seamless product introduction
- 4Interface with global subcontractor partners in Asia to execute development and production plans
- 5Support supply chain initiatives focused on resiliency cost optimization and dual sourcing strategies
- 6Identify and mitigate packaging risks across the supply base
- 7Contribute to architecture and continuous improvement of NPI systems and workflows
- 8Define best practices for package release change management and data integrity
- 9Utilize data driven approaches to improve development cycle time and decision making
- 10Work with assembly master data and leverage insights using KNIME analytics platforms
- 11Lead projects from concept through production in fast paced cross functional global environments
Requirements11
- 1Master’s degree in Mechanical Engineering Materials Science Chemical Engineering Applied Physics or related field
- 23-4 years of experience in microelectronics or semiconductor packaging
- 3Strong understanding of semiconductor assembly processes and package qualification methodologies
- 4Experience in fast paced cross functional global development environments
- 5Ability to drive projects from concept through production
- 6Familiarity with 2D AutoCAD. 3D CAD tools a plus
- 7Experience with OSATs subcontractor ecosystems particularly in Asia
- 8Proficiency with simulation tools like Flotherm and ANSYS
- 9Strong problem solving and analytical skills
- 10Self starter capable of operating in high impact fast paced settings
- 11Excellent communication and stakeholder management abilities
Salary Insight
Salary not disclosed in listing
Location
Required Skills
Similar open positions
Explore active roles that match your skills and interests.
Divergent
VerifiedSenior Packaging Engineer, Additive Manufacturing & Aerospace
You will own packaging engineering for a company building an end-to-end factory system called DAPS, serving automotive and aerospace and defense clients. You will design and validate packaging for high-performance components, working with a team of engineers, program managers, and logistics specialists to meet aggressive timelines and technical specifications. This role offers the chance to shape packaging strategy at a company using machine learning and additive manufacturing to disrupt traditional production. You will work onsite in Los Angeles, with a focus on cost-effective, lifecycle-optimized solutions that protect critical hardware.
Synopsys
VerifiedPrincipal EDA R&D Engineer, Advanced Packaging
You will own R&D projects that advance package substrate design automation, impacting how the semiconductor industry approaches advanced packaging. You will lead tool development for auto-routing, DRC, and power delivery analysis, working with C++, Python, and TCL. You will collaborate directly with foundries and OSATs, translating Design Rule Manuals into functional tooling. Your work will establish technical foundations for next-generation substrate design tools that enable customers to solve problems current tooling cannot.
0001 Applied Materials, Inc
VerifiedProcess Engineer - Advanced Packaging at Applied Materials
Join Applied Materials as a Process Engineer to design and optimize manufacturing processes for display and semiconductor technologies. You will lead complex engineering initiatives and collaborate with top-tier R&D teams to drive innovation. This role offers a unique blend of technical challenge and impact in shaping next-generation hardware.
Diodes Incorporated
VerifiedDirector of Analog Product and Test Engineering
Lead global Product Engineering and Test Engineering teams to own product development from silicon bring-up through production release. Drive new product introduction and manufacturing readiness while ensuring successful product characterization and production ramp. Foster accountability innovation and technical excellence by coaching engineering managers and leading cross-functional collaboration across IC Design Systems Engineering Package Engineering Reliability Quality Fab and AT manufacturing sites.
1000 KLA Corporation
VerifiedSenior Mechanical Engineer Packaging Integration KLA
Lead mechanical design and integration of advanced semiconductor inspection systems including EUV actinic defect inspection platforms. Focus on system-level packaging facility integration and infrastructure design in ultra-high vacuum environments. Drive cross-functional collaboration to deliver robust manufacturable solutions.
Ampere Computing
VerifiedSenior Principal Analog Methodology Engineer
Lead analog design ecosystem optimization at Ampere. Define and improve analog and mixed-signal design flows while integrating foundry Process Design Kits (PDKs). Enhance design productivity and quality across advanced technology nodes.