Principal EDA R&D Engineer, Advanced Packaging
Overview
You will own R&D projects that advance package substrate design automation, impacting how the semiconductor industry approaches advanced packaging. You will lead tool development for auto-routing, DRC, and power delivery analysis, working with C++, Python, and TCL. You will collaborate directly with foundries and OSATs, translating Design Rule Manuals into functional tooling. Your work will establish technical foundations for next-generation substrate design tools that enable customers to solve problems current tooling cannot.
What You'll Do7
- 1Lead R&D projects that advance package substrate design automation, including auto-routing algorithms, DRC verification engines, and power delivery network analysis.
- 2Drive technical direction for database models that enable schematic-driven layout workflows and support integration across the Synopsys packaging tool suite.
- 3Develop and optimize EDA software using C++, Python, and TCL to address complex challenges in computational geometry, constraint solving, and physical design automation.
- 4Collaborate with foundries and assembly and test companies to implement emerging substrate technologies, translating their Design Rule Manuals and manufacturing requirements into functional tooling.
- 5Define collateral input/output formats and integrate analysis capabilities across cross-functional teams.
- 6Provide technical guidance to engineers, reviewing designs and implementations to navigate technical tradeoffs.
- 7Engage in senior-level customer discussions, representing Synopsys expertise in substrate design methodology and influencing product direction.
Requirements7
- 1Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or equivalent experience in EDA or semiconductor design.
- 210+ years in EDA software development with focus on physical design automation, package design, or substrate design.
- 3Deep technical expertise in package substrate physical design methodologies, including schematic-driven layout, auto-routing, design rule checking, and power delivery network analysis.
- 4Strong programming proficiency in Python or TCL for tool integration and automation.
- 5Demonstrated track record leading R&D projects that resulted in production software capabilities or significant architectural improvements.
- 6Experience collaborating with foundries, OSATs, or substrate manufacturers on Design Rule Manuals, technology files, and manufacturing output formats such as ODB++.
- 7Solid foundation in computational geometry and algorithm design for layout automation, with experience in constraint-based routing or placement.
Salary Insight
$166 - $249k per year
Location
Required Skills
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