LightmatterVerified Source

Reliability Engineer (Hardware) at Lightmatter

142K–200K
Partially · San Jose, California
Posted July 25, 2026
payroll

Overview

Own reliability testing for Lightmatter's 3D-stacked photonics engine, Passage™, connecting thousands to millions of processors in extreme-scale AI data centers. You will design and execute robust test protocols, analyze failures, and drive design improvements for our photonics chiplet communication fabric. Work with cross-functional teams of brilliant engineers to ensure products exceed reliability standards. This role offers the chance to shape reliability practices for a $4.4B company leading AI infrastructure.

What You'll Do7

  • 1Develop reliability test plans based on product requirements, industry standards, and customer expectations for photonics-based AI platforms.
  • 2Execute reliability qualification testing for Passage™ and photonics chiplet communication fabrics using HTOL, HAST, TDDB, and THB methodologies.
  • 3Conduct FMEA to identify and mitigate potential reliability risks in device design and manufacturing.
  • 4Perform detailed root cause analysis of device failures using SEM, TEM, FIB, and EMMI; collaborate with cross-functional teams to resolve issues.
  • 5Establish internal reliability guidelines and standards to meet customer requirements and industry benchmarks.
  • 6Use statistical tools like Weibull analysis and JMP to model reliability performance and predict device lifetimes.
  • 7Prepare and present detailed technical reports on reliability test plans, results, and risk assessments to internal and external stakeholders.

Requirements7

  • 15+ years of industry experience as a Reliability Engineer in semiconductor or photonics.
  • 2Bachelor's degree in Electrical Engineering, Computer Engineering, or similar field.
  • 3Understanding of device and package reliability testing: HTOL, HAST, TDDB, HTHH, TC.
  • 4Hands-on experience with failure analysis tools: SEM, TEM, FIB, EMMI.
  • 5Knowledge of device physics and failure mechanisms in Serdes/digital/mixed-signal ICs.
  • 6Understanding of packaging failures: TSV, solder joints, warpage, metal migration.
  • 7Familiarity with reliability modeling and statistical analysis: Weibull, Minitab, JMP.

Salary Insight

$142 - $200k per year

Location

Typepartially
LocationSan Jose, California

Required Skills

Reliability testingFMEAHTOLHASTTDDBHTHHSEMTEMFIBEMMIWeibull analysisMinitabJMPDevice physicsPackaging failure mechanismsStatistical data analysis
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