3D-IC Application Engineer Siemens
Overview
Applications engineer at Siemens EDA supports consultative sales for top semiconductor manufacturers. Secure technical design wins for flagship products like Innovator 3D IC Layout and drive market share growth. Lead architecture and prototyping of emerging 3DIC solutions through flow and script development. Cover key accounts across the United States and collaborate globally. Travel may be required.
What You'll Do7
- 1Deliver technical presentations and conduct product demonstrations
- 2Participate in solution development and account strategy creation
- 3Integrate tools into emerging 3DIC solutions using flows and scripts
- 4Collaborate with worldwide peers and communicate status to stakeholders
- 5Drive technical wins for product and service offerings
- 6Architect and prototype 3DIC solutions by linking tools into cohesive packages
- 7Contribute to benchmarking and demonstration activities
Requirements10
- 1MSEE or BSEE with 4+ years design experience
- 2Significant experience in advanced IC package layout or interposer design
- 3Familiarity with Cadence APD/SiP and Siemens Xpedition/i3DL packages
- 4Proficiency in package design tools from setup to manufacturing document generation
- 5Knowledge of 2.5D and 3D chiplet-based design solutions
- 6Understanding of IC data formats such as Verilog and GDS
- 7Experience with signal/power integrity tools like HyperLynx and Sigrity
- 8Scripting skills in VBS Python Tcl or Perl
- 9Working knowledge of Windows and Linux operating systems
- 10Prior experience as an Applications Engineer preferred
Salary Insight
$251k per year
Location
Required Skills
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