100 Intel CorporationVerified Source

Module Development Engineer Dry Etch Intel Portland

211K–298K
Onsite · Portland, Oregon
Posted August 9, 2026
payroll

Overview

You will own dry etch technology development for Intel's high-volume manufacturing and future nodes. You will drive process integration, equipment solutions, and feasibility studies to meet device specifications, enabling transistor architectures like FinFET and GAA. You will partner with equipment and materials suppliers to shape cost-effective roadmaps. This role demands expert-level plasma physics knowledge and a proven record of delivering etch innovations across multiple nodes.

What You'll Do7

  • 1Drive dry etch process development for high-volume manufacturing, targeting yield improvement, reliability, and technology node transitions.
  • 2Design and implement process integration solutions for advanced device structures, optimizing material selection, parameters, and metrology.
  • 3Lead pathfinding activities for novel device architectures, developing roadmaps for future dry etch capabilities.
  • 4Recommend equipment modifications to improve production efficiency and output for existing products, using DOE and statistical modeling.
  • 5Partner with equipment and materials suppliers to develop enabling technologies and cost-sensitive roadmaps.
  • 6Perform feasibility studies using theoretical simulations and practical engineering methods.
  • 7Monitor industrial trends and shape Intel's future etch technology needs by influencing the vendor ecosystem.

Requirements9

  • 110+ years with PhD or 15+ years with Master's in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or related STEM field.
  • 2Proven track record of technical ownership of dry etch process innovations enabling HVM, yield, or node transitions.
  • 3Expert understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control.
  • 4Experience with advanced data analytics, statistical modeling, and DOE for complex semiconductor problems.
  • 5Recognized technical authority who influences decisions across modules without formal authority.
  • 6Deep experience with advanced etch technologies: HARC, ALE, EUV patterned layer integration, radical/vapor phase etching, ash and surface treatments.
  • 7Expertise in materials characterization: SEM, TEM, CD SEM, AFM, XPS, and electrical correlation.
  • 8Strong publication, patent, or internal disclosure record demonstrating industry contributions.
  • 9Ability to mentor senior engineers and set technical standards for the dry etch discipline.

Salary Insight

$211 - $298k per year

Location

Typeonsite
LocationPortland, Oregon

Required Skills

dry etch processplasma physicsadvanced data analyticsstatistical modelingdesign of experimentsSEMTEMAFM
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