Failure Analysis Nanoprobe Engineer
Overview
Lead electrical characterization of semiconductor IC devices using advanced nanoprobe systems. Own testing plans and deliver findings to internal and external stakeholders. Contribute to fast‑paced semiconductor environment.
What You'll Do9
- 1Conduct electrical characterization of semiconductor IC devices using nanoprobe systems
- 2Evaluate electrical characteristics to determine root cause of failures
- 3Collaborate with Failure Analysis and Product Engineering teams
- 4Work autonomously or within a team to troubleshoot and resolve technical issues
- 5Recommend analysis approach based on customer failure mode data and optical fault isolation results
- 6Generate and compile reports for internal and external customers
- 7Maintain accurate records of experiments data and findings
- 8Perform first‑line tool maintenance and coordinate with vendors for larger issues
- 9Ensure compliance with company and industry safety standards
Requirements11
- 1B.S. to PhD in Electrical/Electronic Engineering Material Science Physics or closely related discipline
- 2Strong understanding of semiconductor FinFET fabrication process and device physics
- 3Basic knowledge of wafer/die level semiconductor processes
- 4Automated Test Equipment tests and FA methodologies
- 5Analytical thinking and problem‑solving ability
- 6Project management and written verbal communication skills
- 7Teamwork oriented player with good communication and interpersonal skills
- 8Ability to work in fast paced multi‑tasking environment
- 9Experience with FA tools such as SEM FIB PVC OBIRCH PEM
- 10Experience with ATE systems like Teradyne UFLEX Advantest V93K or T2000
- 11Interpretation of FA and electrical ATE test data from die level to transistor level
Salary Insight
$76 - $145k per year
Location
Required Skills
Similar open positions
Explore active roles that match your skills and interests.
Actalent
VerifiedQuality Test Engineer, Semiconductor Failure Analysis
You will own failure analysis, qualification testing, and reliability monitoring for semiconductor devices, including high-voltage, analog, mixed-signal ICs, and optically isolated devices. You will run root cause investigations on customer field failures and drive continuous improvement in the on-site failure analysis lab. You will work with ATE, x-ray, and decapsulation tools to identify failure mechanisms. You will partner with R&D and quality teams to release new products and support audits. This role offers the chance to build deep expertise in semiconductor reliability while shaping lab processes.
SMS INFOCOMM CORPORATION
VerifiedFailure Analysis Engineer
Lead first level failure analysis on returned servers and workstations. Document root cause findings and communicate them internally and with clients. Own investigations that drive improvements. Scale processes to handle high volume of incidents. Drive proactive measures to prevent future issues. Bold technical expertise in hardware diagnostics and system repairs.
0001 Applied Materials, Inc
VerifiedProcess Engineer III Defects Technologist
Apply at Applied Materials where you will own defect analysis and troubleshooting for display and semiconductor manufacturing technologies. Lead initiatives to reduce defects and improve production quality. Work with cross-functional teams to expand defect knowledge bases and implement new technologies. Stand out by driving measurable improvements in manufacturing performance and collaborating with global R&D experts.
8213 Avago Technologies U.S. Inc.
VerifiedSenior Integrated Circuit Wafer Probe Engineer
Lead design and validation of custom probe architectures for high density silicon testing. Own end-to-end lifecycle from modeling to debugging. Bridge simulation and real world testing for AI products. Differentiate by solving complex probe challenges beyond standard methods.
Periodic-Labs
VerifiedResearch Engineer Semiconductor Periodic Labs
Own device-level validation of materials work as a Research Engineer, Semiconductor at Periodic Labs. Design and run short-loop experiments measuring electrical performance of novel thin-film stacks from deposition through patterned test vehicles. Contribute technical expertise to customer-facing engagements and collaborate across teams to solve materials problems.
199 Intel Federal LLC
VerifiedPackage Failure Analysis Engineer
Lead root cause determination of assembled package yield loss and in-line failures on a back of week compressed shift. Support technical functions including design test checkout modifications characterization of assembly technologies. Bridge support between shift engineering technicians shift 1 engineers and module partners yield integration and program customers. Ensure inclusive work environment and collaborate to identify mechanisms contributing to yield loss.